산업 기계

​제품정보

 
현대 구조
Micro Chip Visual Inspection System
WVS-MCi6CH
Micro Chip 의 외관상태를 고속으로 검사하는 장치입니다. 
A device that inspects the appearance of Micro Chip at high speed.

Chip

MLCC, LICC, Inductor, Chip-R, Filter and Similar Chip.

Chip

(Inch/mm)

01005(0402), 0201(0603), 0402(1005), 

0603(1608), 0805(2012), 1206(3216), 1210(3225)

Scope 
Defects

6 Side inspection(Top, Front, Bottom, Rear, T1, T2 Insp.)

Camera  

3CCD Color Camera (640×480)

Insp. Res. 

4.93 ㎛/pixel

Insp. Speed. 

Max 8,000pcs/min

Eject Module 

Pin Type Nozzle

Cleaning

Module

WVS-RP3000
Reel에 포장된 Micro Chip 및
Reel Tape 상태를 고속으로 검사하는 장치입니다.
A device that inspects Micro Chip and Reel Tape state packaged in Reel at high speed.

Chip

MLCC, Chip LED, SAW, TCXO, Crystal, Antenna etc.

Various letters making chip

Chip Reel Size

Free size (Φ180-Φ300)

Scope 

3 Sided inspection (Top_1, Bottom, Top_2 Insp.)

Defects

Top_1 Insp. : Marking, Chip rotation, Reverse insert, No chip, Broken, Burr

Bottom Insp. : Carrier Tape Scratch

Top_2 Insp. : Cover Tape Floating, Cover Tape Bonding

Camera

Top_1 Insp. : 3CCD Color camera (640 x 480)
Bottom Insp.: 1CCD Mono camera (640 x 480)
Top_2 Insp. : 1CCD Mono camera (640 x 480)

Insp. Res

14.8 ㎛/pixel

Insp. Speed. 

Max 3,000pcs/min

Eject Module

Pen Type

Optional

Sticker Label Marking

 
추상 구조
Micro Chip Auto Multiple Measurement System
 
WVS-AM100CIB
Micro Chip 의 특성(C/DF, IR, BDV)을 측정하는 장치입니다.
A device that measures Micro Chip properties (C/DF, IR, BDV)

Chip

MLCC

Chip Size

(Inch/mm)

02010603). 0402(1005), 0603(1608). 0805(2012), 1206(3216), 1210(3225)

Process

Loading > Pick up > C/DF measurement > IR measurement

> BDV measurement > Eject

Measurement Tester

[C/DF Tester] – Keysight E4980A, Range : 101F-2mF                            [IR Tester] – Hioki SM7110, Range: 50Ω – 2X1019Ω                              [BDV Tester] – Matsusada HARD-5P60,

                              Range: AC 100V – 120V, DC 1V – 5,000V

Measurement Speed

Max 8,5 pcs/sec (Measurement time excluded)

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

※C/DF : Capacitance/Dissipation Factor
※IR : Insulation Resistance
※BDV : Break Down Voltage

현대 구조
Micro Chip Multiple Pick & Placement System
 
WVS-MT300
Micro Chip 의 특성을 측정하기 위한픽 & 플레이스먼트 장치입니다.
A pick & placement device to measure the properties of Micro Chip

Chip

MLCC

Chip Size

(Inch/mm)

0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)

Process

Plate Loading > Pick up > Rotating > PCB Loading > Mounting

Mounting

Placement in 3 direction(T, W, L) using Rotation Unit

Mounting Speed

Max 7.0 pcs/sec

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

추상 구조
Film Inspection System
 
FAOI-FL05
Film 의 외관 상태를 고속으로 검사하는 장치입니다.
A device that inspects the appearance of the film at high speed.

Insp. Model

FCCL Film (Flexible Copper Clad Laminate)

Scope

1 Sided Inspection (TOP)

Defects

Dent, Scratch, Spot(Black Spot).

Different Thing, Stain, Pin-Hole, Group defects, Periodic defects

Camera

16K Mono Line Scan Camera (HS Link)

Insp. Res

3.5 ㎛/pixel

Insp. Speed

Max 7 m/min

현대 구조
LCD & OLED Vision Inspection Module
 
WVS-AKKON
LCD & OLED Panel의 도전볼을 검사하는 장치입니다.
A device that inspects the conductive particles of the LCD & OLED Panel.

 Insp. Model 

COG & COF & TAB Bonding Panel : 3.5 inch – 42 inch

Panel Sized

3.5 inch – 42 inch

Defects

The number, the strength, the length and the distribution of conductive particles

Insp.

Camera / Res.

4K TDI Mono Line Scan camera / 1.0 ㎛/pixel

Align.

Camera / Res

5M Mono Area Camera/3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec

Using x10 DIC(Differential Interference Contrast) Microscope

WVS-BONDER
LCD & OLED Panel과 Driver IC의 Bonding 상태를 검사하는 장치입니다. 
A device that inspects the bonding status of the LCD & OLED Panel and Driver IC.

Insp. Model

LCD & OLED Panel and Driver IC

Panel Sized

3.5 inch – 42 inch

Defects 

Driver IC recognition, Alignment

Insp.

Camera / Res. 

5M Mono Area Camera / 1.0 ㎛/pixel

Camera / Res. 

5M Mono Area Camera / 3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec

 

군포 본사

104-1001, SK Ventium 166, Gosan-ro,

Gunpo-si, Gyeonggi-do, 15850, Korea

(15850)경기도 군포시 고산로 166, SK벤티움 104동 1001호 

Tel : +82-31-429-2401 / Fax : +82-31-429-2405

안산 공장

35, Emtibeui 4-ro 48beon-gil,

Danwon-gu, Ansan-si, Gyeonggi-do, 15658, Korea

(15658) 경기도 안산시 단원구 엠티브이4로 48번길 35 (목내동)

Tel : +82-70-4694-2460

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