제품정보
Very High Speed Visual Inspection System
WVS-MCi6CX.AI
WVS-MCi6CX.AI is automstic micro chip visual inspection system using Ai algorithm and unique algorithm.
WVS-MCi6CX.AI는독자적인 알고리즘과 AI를 이용하여 마이크로 칩의 외관상태를 고속으로 검사하는장치입니다.
Chip
MLCC, LICC, Inductor, Chip-R, Filter and Similar Chip.
Chip Size
01005(0402), 0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)
Scope
6 Side inspection(Top, Front, Bottom, Rear, T1, T2 Insp.)
Defects
* Ceramic Defects :
Chip outs, Cracks, Holes, De-lamination, Exposed material base,
Electrodes, Missing corners, Surface contamination, Epoxy Hole.
* Termination Defects :
Holes, Scratches, Straight edges, Smears, Surface contamination,
Exposed material base, Silver Hole, Missing corners
* Dimension
Length, Width, Thickness, Terminsltion Bandwidth
Insp. Speed.
Max 10,000pcs/min
Insp. system
AI algorithm and Unique algorithm
Feeding
1 Hopper + 1 Bowl + 1 Linear + 1 Return Feeder
Glass
Φ420 or Φ500
Turn Table
Granite plate (Stone)
Camera
3 CMOS Color Camera (640×480), 250FPS
Insp. Res.
3.7 ㎛/pixel (Based on 0201(0603))
Eject Module
Pin Type Nozzle (NG > OK > Retest )
HVG
High Voltage (Electrostatic) Generator 0~20kv
AI Licence
AI WINTEC developed
Dimension
940 x 980 x 1,835mm (WxDxH)
Weight
Only machine :500KG / After packing :610KG
Reel Package Inspection System
WVS-RP3000
WVS-RP3000 is that inspects Micro Chip and Reel Tape state packaged in Reel at high speed.
WVS-RP3000은 Reel에 포장된 Micro Chip 및 Reel Tape 상태를 고속으로 검사하는 장치입니다.
Chip
MLCC, Chip LED, SAW, TCXO, Crystal, Antenna etc.
Various letters making chip
Reel Size
Free size (Φ180-Φ300)
Scope
Top1, Bottom, Top2
Defects
Top1: Marking, Rotation, Reverse, No chip, Broken, Burr
BTM : Carrier Tape Scratch
Top2: Cover Tape Floating
Camera
Top1: 3CMOS cam.(640 x 480)
BTM : 1CMOS cam.(640 x 480)
Top2: 1CMOS cam.(640 x 480)
Insp. Res
14.8 ㎛/pixel
Insp. Speed.
Max 3,000pcs/min
NG Marking
Pen Type
Optional
Sticker Label Marking
Micro Chip Auto Multiple Measurement System
WVS-AM100CIB
WVS-AM100CIB is that measures Micro Chip properties (C/DF, IR, BDV)
WVS-AM100CIB는 Micro Chip의 전기적인 특성(C/DF,IR,BDV)을 측정하는 장치입니다.
Chip
MLCC
Chip Size
(Inch/mm)
005002(0201), 01005(0402), 0201(0603). 0402(1005),
0603(1608). 0805(2012), 1206(3216), 1210(3225)
Process
Loading > Pick up > C/DF measurement > IR measurement
> BDV measurement > Eject
Measurement Tester
[C/DF Tester] – Keysight E4980A, Range : 101F-2mF
[IR Tester] – Hioki SM7110, Range: 50Ω – 2X1019Ω
[BDV Tester] – Matsusada HARD-5P60,
Range: AC 100V – 120V, DC 1V – 5,000V
Speed
Max 8.5 sec/pcs (Measurement time excluded)
Automatic recognition & Pre-alignment using mono camera
Pick & Placement using nozzle
※C/DF : Capacitance/Dissipation Factor
※IR : Insulation Resistance
※BDV : Break Down Voltage
Micro Chip Multiple Pick & Placement System
WVS-MT300
WVS-MT300 is that uses Pick & Placement to mount micro chips on PCB or substrates.
WVS-MT300은 마이크로 칩을 Pick & Placement를 이용하여 PCB 또는 기판에 정밀 실장하는 장치입니다.
Chip
MLCC
Chip Size
(Inch/mm)
0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)
Process
Plate Loading > Pick up > Rotating > PCB Loading > Mounting
Mounting
Placement in 3 direction(T, W, L) using Rotation Unit
Mounting Speed
Max 7.0 pcs/sec
Automatic recognition & Pre-alignment using mono camera
Pick & Placement using nozzle
FILM Inspection System
WVS-FAOI_CF150
WVS-FAOI_CF150 is that inspects the appearance of the film at high speed.
WVS-FAOI_CF150 Film 의 외관 상태를 고속으로 검사하는 장치입니다.
Insp. Model
FCCL Film (Flexible Copper Clad Laminate)
Scope
1 Sided Inspection (TOP)
Defects
Dent, Scratch, Spot(Black Spot).
Different Thing, Stain, Pin-Hole, Group defects, Periodic defects
Camera
16K Mono Line Scan Camera (HS Link)
Insp. Res
3.5 ㎛/pixel
Insp. Speed
Max 7 m/min
X-ray Inspection System
WXI-CT160 (Nano Focus X-Ray CT)
WXI-CT160 는 X-ray를 이용한 비파괴 검사를 통하여 제품의 불량 유무를 검사하는 장치입니다.
WXI-CT160 is inspect the product for defects through non-destructive inspection using X-ray.
Applications
X-Ray tube
Type
Min. focal spot
Voltage
Max. current
Max. power
Detector
Resolution
Frame rate
Stage
Axis
SMT, PCB, PKG, Wafer, LED, Electronics, Battery, Haness, ETC..
Nano focus open tube
0.5µm
30kv ~ 160kv
1,000µA
10W (Option : 25W)
2,352 x 2,944 pixel
50fps(1x1), 100fps(2x2)
Total 7 axis
Base X, Y, Z, R / Stage X, Y / Detector Tilt T / Collimator & Shutter
Table size
Tilt degree
510 X 470 mm
Max 60°
CT
Type
Magnification
Geometric
Oblique CT, Cone beam CT dual type
x 2 ~ x 2,000
Digital
System
Dimension
x 2 ~ x 16,000
1,740(L) x 1,940(W) x 2,260(H) mm
Weight
3.800 kg
About 5 kg
Stage stock weight
CT tact time
(1frame / 1°/0.5°/0.25°/0.125°)
12sec(30fps), 8sec(50fps), 4sec(100fps)
WXI-CT130(Micro Focus X-Ray CT)
WXI-CT130 는 X-ray를 이용한 비파괴 검사를 통하여 제품의 불량 유무를 검사하는 장치입니다.
WXI-CT130 is inspect the product for defects through non-destructive inspection using X-ray.
Applications
X-Ray tube
Type
Min. focal spot
Voltage
Max. current
Max. power
Detector
Resolution
Frame rate
Stage
Axis
CT
Table size
Tilt degree
Type
Magnification
Geometric
SMT, PCB, PKG, Wafer, LED, Electronics, Battery, Haness, ETC..
Micro focus Close tube
4µm
50kV ~ 130kV
500µA
65 Watt
2,352 x 2,944 pixel
50fps(1x1), 100fps(2x2)
Total 5 axis
Stage X, Y, Z / Detector Tilt T / Cone Beam R
Max 50°
500 X 500 mm
Cone beam CT type
x 2 ~ x 45 (Customizing Option x 54)
Digital
x 2 ~ x 16,000
System
Dimension
Weight
1,350 (W) x 1,520 (L) x 1,670 (H) mm
1,200 kg
5 kg
Stage stock weight
CT tact time
(1frame / 1°/0.5°/0.25°/0.125°)
12sec, 24sec, 48sec, 96sec, 210sec, More~
X-ray Inspection System
COF Inspection System
COF Insp. System
COF Insp. System 는 COF PKG의 외관상태를 고속으로 검사하는 장치입니다.
COF Insp. System is COF PKG visual inspection system.
![[포맷변환]IMG_8157_4.png](https://static.wixstatic.com/media/363394_db22e6ff54f24f37b7d73e99b32736ac~mv2.png/v1/fill/w_653,h_410,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/%5B%ED%8F%AC%EB%A7%B7%EB%B3%80%ED%99%98%5DIMG_8157_4.png)
항목
검사대상
장비크키
Cycle Time
구동 방식
설비
적용 릴 사이즈
정전기 제어
금속성 이물제거
평탄도
검사 항목
검사
검사 방식
검증/판정
사양
비고
COF PKG
48, 70㎜ (필름 가로 방향 기준)
3100(W) x 900(D)x 1900(H) ㎜
2.0 sec/ea
8pf Dual검사 기준
스프라켓 구동 방식, Center 정렬 방식
48, 70 mm 가변 가능
MAX 620mm
이오나이저 12개소 이상 설치
자석 봉 설치
제품 평탄도를 위하여 제품을 펴는 구조 설치
필름 패턴 검사 (이물, 스크래치 등) 칩 검사 (크랙, 미세 크랙 등)
PI 검사 (찍힘, 눌림 등)
2D Area Scan Camera, 계측기
패턴, Dent, Burr 검사 : Vision
칩 검사 : Vision 및 칩 용량 검사 (계측기 사용)
LCD & OLED Vision Inspection Module
WVS-AKKON
LCD & OLED Panel의 도전볼을 검사하는 장치입니다.
A device that inspects the conductive particles of the LCD & OLED Panel.
Insp. Model
COG & COF & TAB Bonding Panel : 3.5 inch – 42 inch
Panel Sized
3.5 inch – 42 inch
Defects
The number, the strength, the length and the distribution of conductive particles
Insp.
Camera / Res.
4K TDI Mono Line Scan camera / 1.0 ㎛/pixel
Align.
Camera / Res
5M Mono Area Camera/3.5 ㎛/pixel
Insp. Speed
Max 55 mm/sec
Using x10 DIC(Differential Interference Contrast) Microscope
WVS-BONDER
A device that inspects the bonding status of the LCD & OLED Panel and Driver IC.
LCD & OLED Panel과 Driver IC의 Bonding 상태를 검사하는 장치입니다.
Insp. Model
LCD & OLED Panel and Driver IC
Panel Sized
3.5 inch – 42 inch
Defects
Driver IC recognition, Alignment
Insp.
Camera / Res.
5M Mono Area Camera / 1.0 ㎛/pixel
Camera / Res.
5M Mono Area Camera / 3.5 ㎛/pixel
Insp. Speed
Max 55 mm/sec
