산업 기계

​제품정보

 
현대 구조
Micro Chip Visual Inspection System
WVS-MCi6CH
Micro Chip 의 외관상태를 고속으로 검사하는 장치입니다. 
A device that inspects the appearance of Micro Chip at high speed.
WVS-MCi6CH.jpg

Chip

MLCC, LICC, Inductor, Chip-R, Filter and Similar Chip.

Chip

(Inch/mm)

01005(0402), 0201(0603), 0402(1005), 

0603(1608), 0805(2012), 1206(3216), 1210(3225)

Scope 
Defects

6 Side inspection(Top, Front, Bottom, Rear, T1, T2 Insp.)

Camera  

3CCD Color Camera (640×480)

Insp. Res. 

4.93 ㎛/pixel

Insp. Speed. 

Max 8,000pcs/min

Eject Module 

Pin Type Nozzle

Cleaning

Module

WVS-RP3000
Reel에 포장된 Micro Chip 및
Reel Tape 상태를 고속으로 검사하는 장치입니다.
A device that inspects Micro Chip and Reel Tape state packaged in Reel at high speed.
WVS-RP3000.png

Chip

MLCC, Chip LED, SAW, TCXO, Crystal, Antenna etc.

Various letters making chip

Chip Reel Size

Free size (Φ180-Φ300)

Scope 

3 Sided inspection (Top_1, Bottom, Top_2 Insp.)

Defects

Top_1 Insp. : Marking, Chip rotation, Reverse insert, No chip, Broken, Burr

Bottom Insp. : Carrier Tape Scratch

Top_2 Insp. : Cover Tape Floating, Cover Tape Bonding

Camera

Top_1 Insp. : 3CCD Color camera (640 x 480)
Bottom Insp.: 1CCD Mono camera (640 x 480)
Top_2 Insp. : 1CCD Mono camera (640 x 480)

Insp. Res

14.8 ㎛/pixel

Insp. Speed. 

Max 3,000pcs/min

Eject Module

Pen Type

Optional

Sticker Label Marking

 
추상 구조
Micro Chip Auto Multiple Measurement System
 
WVS-AM100CIB
Micro Chip 의 특성(C/DF, IR, BDV)을 측정하는 장치입니다.
A device that measures Micro Chip properties (C/DF, IR, BDV)
WVS-AM100CIB.png

Chip

MLCC

Chip Size

(Inch/mm)

02010603). 0402(1005), 0603(1608). 0805(2012), 1206(3216), 1210(3225)

Process

Loading > Pick up > C/DF measurement > IR measurement

> BDV measurement > Eject

Measurement Tester

[C/DF Tester] – Keysight E4980A, Range : 101F-2mF                            [IR Tester] – Hioki SM7110, Range: 50Ω – 2X1019Ω                              [BDV Tester] – Matsusada HARD-5P60,

                              Range: AC 100V – 120V, DC 1V – 5,000V

Measurement Speed

Max 8,5 pcs/sec (Measurement time excluded)

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

※C/DF : Capacitance/Dissipation Factor
※IR : Insulation Resistance
※BDV : Break Down Voltage

현대 구조
Micro Chip Multiple Pick & Placement System
 
WVS-MT300
Micro Chip 의 특성을 측정하기 위한 픽&플레이스먼트 장치입니다.
A pick & placement device to measure the properties of Micro Chip
WVS-MT300.png

Chip

MLCC

Chip Size

(Inch/mm)

0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)

Process

Plate Loading > Pick up > Rotating > PCB Loading > Mounting

Mounting

Placement in 3 direction(T, W, L) using Rotation Unit

Mounting Speed

Max 7.0 pcs/sec

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

추상 구조
Film Inspection System
 
FAOI-FL05
Film 의 외관 상태를 고속으로 검사하는 장치입니다.
A device that inspects the appearance of the film at high speed.
제품사진5.jpg

Insp. Model

FCCL Film (Flexible Copper Clad Laminate)

Scope

1 Sided Inspection (TOP)

Defects

Dent, Scratch, Spot(Black Spot).

Different Thing, Stain, Pin-Hole, Group defects, Periodic defects

Camera

16K Mono Line Scan Camera (HS Link)

Insp. Res

3.5 ㎛/pixel

Insp. Speed

Max 7 m/min

현대 구조
LCD & OLED Vision Inspection Module
 
WVS-AKKON
LCD & OLED Panel의 도전볼을 검사하는 장치입니다.
A device that inspects the conductive particles of the LCD & OLED Panel.
제품사진6.jpg

 Insp. Model 

COG & COF & TAB Bonding Panel : 3.5 inch – 42 inch

Panel Sized

3.5 inch – 42 inch

Defects

The number, the strength, the length and the distribution of conductive particles

Insp.

Camera / Res.

4K TDI Mono Line Scan camera / 1.0 ㎛/pixel

Align.

Camera / Res

5M Mono Area Camera/3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec

Using x10 DIC(Differential Interference Contrast) Microscope

WVS-BONDER
LCD & OLED Panel과 Driver IC의 Bonding 상태를 검사하는 장치입니다. 
A device that inspects the bonding status of the LCD & OLED Panel and Driver IC.
제품사진7.jpg

Insp. Model

LCD & OLED Panel and Driver IC

Panel Sized

3.5 inch – 42 inch

Defects 

Driver IC recognition, Alignment

Insp.

Camera / Res. 

5M Mono Area Camera / 1.0 ㎛/pixel

Camera / Res. 

5M Mono Area Camera / 3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec