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​제품정보

 
현대 구조
Very High Speed Visual Inspection System
WVS-MCi6CX.AI

WVS-MCi6CX.AI is automstic micro chip visual inspection system using Ai algorithm and unique algorithm.

WVS-MCi6CX.AI는독자적인 알고리즘과 AI를 이용하여  마이크로 칩의 외관상태를 고속으로 검사하는장치입니다.

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Chip

MLCC, LICC, Inductor, Chip-R, Filter and Similar Chip.

Chip Size

01005(0402), 0201(0603), 0402(1005), 

0603(1608), 0805(2012), 1206(3216), 1210(3225)

Scope 

6 Side inspection(Top, Front, Bottom, Rear, T1, T2 Insp.)

Insp. Speed. 

Max 10,000pcs/min

Insp. system

AI algorithm and Unique algorithm 

Feeding

1 Hopper + 1 Bowl +  1 Linear + 1 Return  Feeder

Glass 

Φ420  or Φ500

Turn Table

Granite plate (Stone)

Insp. Res. 

3.7  ㎛/pixel  (Based on  0201(0603))

Camera  

3 CMOS  Color Camera (640×480), 250FPS

Eject Module 

Pin Type Nozzle  (NG > OK > Retest )

HVG

High Voltage (Electrostatic) Generator 0~20kv

AI Licence

AI Licence Dongle WINTEC developed

Dimension

940 x 980 x 1,835mm  (WxDxH)

Weight

Only machine :500KG /  After packing :610KG

Defects 

* Ceramic Defects :

    Chip outs, Cracks, Holes, De-lamination,  Exposed material base,
     Electrodes, Missing corners,  Surface contamination, Epoxy Hole.

* Termination Defects  :

     Holes, Scratches, Straight edges, Smears,  Surface  contamination,
     Exposed material base, Silver Hole,  Missing corners
* Dimension
     Length, Width, Thickness, Terminsltion Bandwidth

 
WVS-RP3000

WVS-RP3000은 Reel에 포장된 Micro Chip 및 Reel Tape 상태를 고속으로 검사하는 장치입니다.

A device that inspects Micro Chip and Reel Tape state packaged in Reel at high speed.

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Chip

MLCC, Chip LED, SAW, TCXO, Crystal, Antenna etc.

Various letters making chip

Chip Reel Size

Free size (Φ180-Φ300)

Scope 

3 Sided inspection (Top_1, Bottom, Top_2 Insp.)

Defects

Top_1 Insp. : Marking, Chip rotation, Reverse insert, No chip, Broken, Burr

Bottom Insp. : Carrier Tape Scratch

Top_2 Insp. : Cover Tape Floating, Cover Tape Bonding

Camera

Top_1 Insp. : 3CCD Color camera (640 x 480)
Bottom Insp.: 1CCD Mono camera (640 x 480)
Top_2 Insp. : 1CCD Mono camera (640 x 480)

Insp. Res

14.8 ㎛/pixel

Insp. Speed. 

Max 3,000pcs/min

Eject Module

Pen Type

Optional

Sticker Label Marking

추상 구조
Micro Chip Auto Multiple Measurement System
 
WVS-AM100CIB

WVS-AM100CIB는 Micro Chip의 특성(C/DF,IR,BDV)을 측정하는 장치입니다.

A device that measures Micro Chip properties (C/DF, IR, BDV)

WVS-AM100CIB.png

Chip

MLCC

Chip Size

(Inch/mm)

005002(0201), 01005(0402), 0201(0603). 0402(1005),

0603(1608). 0805(2012), 1206(3216), 1210(3225)

Process

Loading > Pick up > C/DF measurement > IR measurement

> BDV measurement > Eject

Measurement Tester

[C/DF Tester] – Keysight E4980A, Range : 101F-2mF                            [IR Tester] – Hioki SM7110, Range: 50Ω – 2X1019Ω                              [BDV Tester] – Matsusada HARD-5P60,

                              Range: AC 100V – 120V, DC 1V – 5,000V

Measurement Speed

Max 8.5 sec/pcs (Measurement time excluded)

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

※C/DF : Capacitance/Dissipation Factor
※IR : Insulation Resistance
※BDV : Break Down Voltage

현대 구조
Micro Chip Multiple Pick & Placement System
 
WVS-MT300

MicMicro Chip 의 특성을 측정하기 위한 픽&플레이스먼트 장치입니다.

A pick & placement device to measure the properties of Micro Chip

WVS-MT300.png

Chip

MLCC

Chip Size

(Inch/mm)

0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)

Process

Plate Loading > Pick up > Rotating > PCB Loading > Mounting

Mounting

Placement in 3 direction(T, W, L) using Rotation Unit

Mounting Speed

Max 7.0 pcs/sec

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

추상 구조
Film Inspection System
 
FAOI-FL05

Film 의 외관 상태를 고속으로 검사하는 장치입니다.

A device that inspects the appearance of the film at high speed.

제품사진5.jpg

Insp. Model

FCCL Film (Flexible Copper Clad Laminate)

Scope

1 Sided Inspection (TOP)

Defects

Dent, Scratch, Spot(Black Spot).

Different Thing, Stain, Pin-Hole, Group defects, Periodic defects

Camera

16K Mono Line Scan Camera (HS Link)

Insp. Res

3.5 ㎛/pixel

Insp. Speed

Max 7 m/min

Video View
추상 구조
X-ray  Inspection System
 
WXI-CT130(Micro Focus X-Ray CT)

X-ray를 이용한 비파괴 검사를 통하여 제품의 불량 유무를 검사하는 장치입니다.

Inspect the product for defects through non-destructive inspection using X-ray.

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Applications

SMT, PCB, PKG, Wafer, LED, Electronics, Battery, Haness, ETC..

Type

Micro focus Close tube

4µm

50kV ~ 130kV

500µA

65 Watt

Detector

Resolution

2,352 x 2,944 pixel

Stage

Axis

Total 5 axis

 Stage X, Y, Z / Detector Tilt T / Cone Beam R

Table size 

Tilt degree

CT

Type

Cone beam CT type

Magnification

Geometric

Digital

x 2 ~ x 45 (Customizing Option x 54)

x 2 ~ x 16,000

System

Dimension

1,350 (W) x 1,520 (L) x 1,670 (H) mm

5 kg

Weight

Stage stock weight

1,200 kg

CT tact time

(1frame / 1°/0.5°/0.25°/0.125°)

12sec, 24sec, 48sec, 96sec, 210sec, More~

Min. focal spot

Voltage

Max. power

X-Ray tube

Frame rate

50fps(1x1), 100fps(2x2)

500 X 500 mm

Max 50°

Max. current

 
WXI-CT160 (Nano Focus X-Ray CT)

X-ray를 이용한 비파괴 검사를 통하여 제품의 불량 유무를 검사하는 장치입니다.

Inspect the product for defects through non-destructive inspection using X-ray.

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Applications

SMT, PCB, PKG, Wafer, LED, Electronics, Battery, Haness, ETC..

X-Ray tube

Type

Max. current

Voltage

Min. focal spot

Max. power

Nano focus open tube

1,000µA

30kv ~ 160kv

0.5µm

10W (Option : 25W)

Detector

Resolution

Frame rate

2,352 x 2,944 pixel

50fps(1x1), 100fps(2x2)

Stage

Axis

Total 7 axis

Table size 

Tilt degree

Base X, Y, Z, R / Stage X, Y / Detector Tilt T / Collimator & Shutter 

510 X 470 mm

Max 60°

CT

Type

Oblique CT, Cone beam CT dual type

Magnification

Geometric

Digital

x 2 ~ x 2,000

x 2 ~ x 16,000

System

Dimension

1,740(L) x 1,940(W) x 2,260(H) mm

About 5 kg

Weight

Stage stock weight

3.800 kg

CT tact time

(1frame / 1°/0.5°/0.25°/0.125°)

12sec(30fps), 8sec(50fps), 4sec(100fps)

Video View
 
추상 구조
COF 외관검사기
COF 외관검사기
 

COF의 외관상태를 검사하는 장치 입니다.

A device that inspects the appearance of the COF

[포맷변환]IMG_8157_4.png

​항목

검사대상

장비크키

Cycle Time

구동 방식

적용 릴 사이즈

정전기 제어

설비

금속성 이물제거

평탄도

사양

​비고

COF PKG

48, 70㎜ (필름 가로 방향 기준)

3100(W) x 900(D)x 1900(H) ㎜

2.0 sec/ea

8pf Dual검사 기준

스프라켓 구동 방식, Center 정렬 방식

48, 70 mm 가변 가능

MAX 620mm

이오나이저 12개소 이상 설치

자석 봉 설치

제품 평탄도를 위하여 제품을 펴는 구조 설치

검사 항목

​검사

검사 방식

검증/판정

필름 패턴 검사 (이물, 스크래치 등) 칩 검사 (크랙, 미세 크랙 등)

PI 검사 (찍힘, 눌림 등)

2D Area Scan Camera, 계측기

패턴, Dent, Burr 검사 : Vision

칩 검사 : Vision 및 칩 용량 검사 (계측기 사용)

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Video View
 
현대 구조
LCD & OLED Vision Inspection Module
WVS-AKKON

LCD & OLED Panel의 도전볼을 검사하는 장치입니다.

A device that inspects the conductive particles of the LCD & OLED Panel.

제품사진6.jpg

 Insp. Model 

COG & COF & TAB Bonding Panel : 3.5 inch – 42 inch

Panel Sized

3.5 inch – 42 inch

Defects

The number, the strength, the length and the distribution of conductive particles

Insp.

Camera / Res.

4K TDI Mono Line Scan camera / 1.0 ㎛/pixel

Align.

Camera / Res

5M Mono Area Camera/3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec

Using x10 DIC(Differential Interference Contrast) Microscope

Video View
WVS-BONDER

A device that inspects the bonding status of the LCD & OLED Panel and Driver IC.

LCD & OLED Panel과 Driver IC의 Bonding 상태를 검사하는 장치입니다. 

제품사진7.jpg

Insp. Model

LCD & OLED Panel and Driver IC

Panel Sized

3.5 inch – 42 inch

Defects 

Driver IC recognition, Alignment

Insp.

Camera / Res. 

5M Mono Area Camera / 1.0 ㎛/pixel

Camera / Res. 

5M Mono Area Camera / 3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec

Video View