제품정보
Micro Chip Visual Inspection System
WVS-MCi6CH
Micro Chip 의 외관상태를 고속으로 검사하는 장치입니다.
A device that inspects the appearance of Micro Chip at high speed.
Chip
MLCC, LICC, Inductor, Chip-R, Filter and Similar Chip.
Chip
(Inch/mm)
01005(0402), 0201(0603), 0402(1005),
0603(1608), 0805(2012), 1206(3216), 1210(3225)
Scope
Defects
6 Side inspection(Top, Front, Bottom, Rear, T1, T2 Insp.)
Camera
3CCD Color Camera (640×480)
Insp. Res.
4.93 ㎛/pixel
Insp. Speed.
Max 8,000pcs/min
Eject Module
Pin Type Nozzle
Cleaning
Module
WVS-RP3000
Reel에 포장된 Micro Chip 및
Reel Tape 상태를 고속으로 검사하는 장치입니다.
A device that inspects Micro Chip and Reel Tape state packaged in Reel at high speed.
Chip
MLCC, Chip LED, SAW, TCXO, Crystal, Antenna etc.
Various letters making chip
Chip Reel Size
Free size (Φ180-Φ300)
Scope
3 Sided inspection (Top_1, Bottom, Top_2 Insp.)
Defects
Top_1 Insp. : Marking, Chip rotation, Reverse insert, No chip, Broken, Burr
Bottom Insp. : Carrier Tape Scratch
Top_2 Insp. : Cover Tape Floating, Cover Tape Bonding
Camera
Top_1 Insp. : 3CCD Color camera (640 x 480)
Bottom Insp.: 1CCD Mono camera (640 x 480)
Top_2 Insp. : 1CCD Mono camera (640 x 480)
Insp. Res
14.8 ㎛/pixel
Insp. Speed.
Max 3,000pcs/min
Eject Module
Pen Type
Optional
Sticker Label Marking
Micro Chip Auto Multiple Measurement System
WVS-AM100CIB
Micro Chip 의 특성(C/DF, IR, BDV)을 측정하는 장치입니다.
A device that measures Micro Chip properties (C/DF, IR, BDV)
Chip
MLCC
Chip Size
(Inch/mm)
005002(0201), 01005(0402), 0201(0603). 0402(1005),
0603(1608). 0805(2012), 1206(3216), 1210(3225)
Process
Loading > Pick up > C/DF measurement > IR measurement
> BDV measurement > Eject
Measurement Tester
[C/DF Tester] – Keysight E4980A, Range : 101F-2mF [IR Tester] – Hioki SM7110, Range: 50Ω – 2X1019Ω [BDV Tester] – Matsusada HARD-5P60,
Range: AC 100V – 120V, DC 1V – 5,000V
Measurement Speed
Max 8.5 sec/pcs (Measurement time excluded)
Automatic recognition & Pre-alignment using mono camera
Pick & Placement using nozzle
※C/DF : Capacitance/Dissipation Factor
※IR : Insulation Resistance
※BDV : Break Down Voltage
Micro Chip Multiple Pick & Placement System
WVS-MT300
Micro Chip 의 특성을 측정하기 위한 픽&플레이스먼트 장치입니다.
A pick & placement device to measure the properties of Micro Chip
Chip
MLCC
Chip Size
(Inch/mm)
0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)
Process
Plate Loading > Pick up > Rotating > PCB Loading > Mounting
Mounting
Placement in 3 direction(T, W, L) using Rotation Unit
Mounting Speed
Max 7.0 pcs/sec
Automatic recognition & Pre-alignment using mono camera
Pick & Placement using nozzle
Film Inspection System
FAOI-FL05
Film 의 외관 상태를 고속으로 검사하는 장치입니다.
A device that inspects the appearance of the film at high speed.
Insp. Model
FCCL Film (Flexible Copper Clad Laminate)
Scope
1 Sided Inspection (TOP)
Defects
Dent, Scratch, Spot(Black Spot).
Different Thing, Stain, Pin-Hole, Group defects, Periodic defects
Camera
16K Mono Line Scan Camera (HS Link)
Insp. Res
3.5 ㎛/pixel
Insp. Speed
Max 7 m/min
LCD & OLED Vision Inspection Module
WVS-AKKON
LCD & OLED Panel의 도전볼을 검사하는 장치입니다.
A device that inspects the conductive particles of the LCD & OLED Panel.
Insp. Model
COG & COF & TAB Bonding Panel : 3.5 inch – 42 inch
Panel Sized
3.5 inch – 42 inch
Defects
The number, the strength, the length and the distribution of conductive particles
Insp.
Camera / Res.
4K TDI Mono Line Scan camera / 1.0 ㎛/pixel
Align.
Camera / Res
5M Mono Area Camera/3.5 ㎛/pixel
Insp. Speed
Max 55 mm/sec
Using x10 DIC(Differential Interference Contrast) Microscope
WVS-BONDER
LCD & OLED Panel과 Driver IC의 Bonding 상태를 검사하는 장치입니다.
A device that inspects the bonding status of the LCD & OLED Panel and Driver IC.
Insp. Model
LCD & OLED Panel and Driver IC
Panel Sized
3.5 inch – 42 inch
Defects
Driver IC recognition, Alignment
Insp.
Camera / Res.
5M Mono Area Camera / 1.0 ㎛/pixel
Camera / Res.
5M Mono Area Camera / 3.5 ㎛/pixel
Insp. Speed
Max 55 mm/sec