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​제품정보

 
현대 구조
Very High Speed Visual Inspection System
WVS-MCi6CX.AI

WVS-MCi6CX.AI is automstic micro chip visual inspection system using Ai algorithm and unique algorithm.

WVS-MCi6CX.AI는독자적인 알고리즘과 AI를 이용하여  마이크로 칩의 외관상태를 고속으로 검사하는장치입니다.

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Chip

MLCC, LICC, Inductor, Chip-R, Filter and Similar Chip.

Chip Size

01005(0402), 0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)

Scope 

6 Side inspection(Top, Front, Bottom, Rear, T1, T2 Insp.)

Defects 

* Ceramic Defects :

    Chip outs, Cracks, Holes, De-lamination,  Exposed material base,
     Electrodes, Missing corners,  Surface contamination, Epoxy Hole.

* Termination Defects  :

     Holes, Scratches, Straight edges, Smears,  Surface  contamination,
     Exposed material base, Silver Hole,  Missing corners
* Dimension
     Length, Width, Thickness, Terminsltion Bandwidth

Insp. Speed. 

Max 10,000pcs/min

Insp. system

AI algorithm and Unique algorithm 

Feeding

1 Hopper + 1 Bowl +  1 Linear + 1 Return  Feeder

Glass 

Φ420  or Φ500

Turn Table

Granite plate (Stone)

Camera  

3 CMOS  Color Camera (640×480), 250FPS

Insp. Res. 

3.7  ㎛/pixel  (Based on  0201(0603))

Eject Module 

Pin Type Nozzle  (NG > OK > Retest )

HVG

High Voltage (Electrostatic) Generator 0~20kv

AI Licence

AI  WINTEC developed

Dimension

940 x 980 x 1,835mm  (WxDxH)

Weight

Only machine :500KG /  After packing :610KG

현대 구조
Reel Package Inspection System
 
WVS-RP3000

WVS-RP3000 is that inspects Micro Chip and Reel Tape state packaged in Reel at high speed.

WVS-RP3000은 Reel에 포장된 Micro Chip 및 Reel Tape 상태를 고속으로 검사하는 장치입니다.

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Chip

MLCC, Chip LED, SAW, TCXO, Crystal, Antenna etc.

Various letters making chip

Reel Size

Free size (Φ180-Φ300)

Scope 

Top1, Bottom, Top2

Defects

Top1: Marking, Rotation, Reverse, No chip, Broken, Burr

BTM : Carrier Tape Scratch

Top2: Cover Tape Floating

Camera

Top1: 3CMOS cam.(640 x 480)
BTM : 1CMOS cam.(640 x 480)
Top2: 1CMOS cam.(640 x 480)

Insp. Res

14.8 ㎛/pixel

Insp. Speed. 

Max 3,000pcs/min

NG Marking

Pen Type

Optional

Sticker Label Marking

 
추상 구조
Micro Chip Auto Multiple Measurement System
WVS-AM100CIB

WVS-AM100CIB is that measures Micro Chip properties (C/DF, IR, BDV)

WVS-AM100CIB는 Micro Chip의 전기적인 특성(C/DF,IR,BDV)을 측정하는 장치입니다.

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Chip

MLCC

Chip Size

(Inch/mm)

005002(0201), 01005(0402), 0201(0603). 0402(1005),

0603(1608). 0805(2012), 1206(3216), 1210(3225)

Process

Loading > Pick up > C/DF measurement > IR measurement

> BDV measurement > Eject

Measurement Tester

[C/DF Tester] – Keysight E4980A, Range : 101F-2mF                           

[IR Tester] – Hioki SM7110, Range: 50Ω – 2X1019Ω         

[BDV Tester] – Matsusada HARD-5P60,

Range: AC 100V – 120V, DC 1V – 5,000V

 Speed

Max 8.5 sec/pcs (Measurement time excluded)

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

※C/DF : Capacitance/Dissipation Factor
※IR : Insulation Resistance
※BDV : Break Down Voltage

현대 구조
Micro Chip Multiple Pick & Placement System
 
WVS-MT300

WVS-MT300 is that uses Pick & Placement to mount micro chips on PCB or substrates.

WVS-MT300은 마이크로 칩을 Pick & Placement를 이용하여 PCB 또는 기판에 정밀 실장하는 장치입니다.

Chip

MLCC

Chip Size

(Inch/mm)

0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)

Process

Plate Loading > Pick up > Rotating > PCB Loading > Mounting

Mounting

Placement in 3 direction(T, W, L) using Rotation Unit

Mounting Speed

Max 7.0 pcs/sec

Automatic recognition & Pre-alignment using mono camera

Pick & Placement using nozzle

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추상 구조
FILM  Inspection System
 
WVS-FAOI_CF150

WVS-FAOI_CF150 is that inspects the appearance of the film at high speed.

WVS-FAOI_CF150 Film 의 외관 상태를 고속으로 검사하는 장치입니다.

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Insp. Model

FCCL Film (Flexible Copper Clad Laminate)

Scope

1 Sided Inspection (TOP)

Defects

Dent, Scratch, Spot(Black Spot).

Different Thing, Stain, Pin-Hole, Group defects, Periodic defects

Camera

16K Mono Line Scan Camera (HS Link)

Insp. Res

3.5 ㎛/pixel

Insp. Speed

Max 7 m/min

추상 구조
X-ray  Inspection System
 
WXI-CT160 (Nano Focus X-Ray CT)

WXI-CT160 는 X-ray를 이용한 비파괴 검사를 통하여 제품의 불량 유무를 검사하는 장치입니다.

WXI-CT160 is inspect the product for defects through non-destructive inspection using X-ray.

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Applications

X-Ray tube

Type

Min. focal spot

Voltage

Max. current

Max. power

Detector

Resolution

Frame rate

Stage

Axis

SMT, PCB, PKG, Wafer, LED, Electronics, Battery, Haness, ETC..

Nano focus open tube

0.5µm

30kv ~ 160kv

1,000µA

10W (Option : 25W)

2,352 x 2,944 pixel

50fps(1x1), 100fps(2x2)

Total 7 axis

Base X, Y, Z, R / Stage X, Y / Detector Tilt T / Collimator & Shutter 

Table size 

Tilt degree

510 X 470 mm

Max 60°

CT

Type

Magnification

Geometric

Oblique CT, Cone beam CT dual type

x 2 ~ x 2,000

Digital

System

Dimension

x 2 ~ x 16,000

1,740(L) x 1,940(W) x 2,260(H) mm

Weight

3.800 kg

About 5 kg

Stage stock weight

CT tact time

(1frame / 1°/0.5°/0.25°/0.125°)

12sec(30fps), 8sec(50fps), 4sec(100fps)

Video View
 
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WXI-CT130(Micro Focus X-Ray CT)

WXI-CT130 는 X-ray를 이용한 비파괴 검사를 통하여 제품의 불량 유무를 검사하는 장치입니다.

WXI-CT130 is inspect the product for defects through non-destructive inspection using X-ray.

WXI-130.png

Applications

X-Ray tube

Type

Min. focal spot

Voltage

Max. current

Max. power

Detector

Resolution

Frame rate

Stage

Axis

CT

Table size 

Tilt degree

Type

Magnification

Geometric

SMT, PCB, PKG, Wafer, LED, Electronics, Battery, Haness, ETC..

Micro focus Close tube

4µm

50kV ~ 130kV

500µA

65 Watt

2,352 x 2,944 pixel

50fps(1x1), 100fps(2x2)

Total 5 axis

 Stage X, Y, Z / Detector Tilt T / Cone Beam R

Max 50°

500 X 500 mm

Cone beam CT type

x 2 ~ x 45 (Customizing Option x 54)

Digital

x 2 ~ x 16,000

System

Dimension

Weight

1,350 (W) x 1,520 (L) x 1,670 (H) mm

1,200 kg

5 kg

Stage stock weight

CT tact time

(1frame / 1°/0.5°/0.25°/0.125°)

12sec, 24sec, 48sec, 96sec, 210sec, More~

추상 구조
X-ray  Inspection System
 
추상 구조
COF Inspection System
COF Insp. System

COF Insp. System 는 COF PKG의 외관상태를 고속으로 검사하는 장치입니다.

COF Insp. System ​is COF PKG visual inspection system.

[포맷변환]IMG_8157_4.png

​항목

검사대상

장비크키

Cycle Time

구동 방식

설비

적용 릴 사이즈

정전기 제어

금속성 이물제거

평탄도

검사 항목

​검사

검사 방식

검증/판정

사양

​비고

COF PKG

48, 70㎜ (필름 가로 방향 기준)

3100(W) x 900(D)x 1900(H) ㎜

2.0 sec/ea

8pf Dual검사 기준

스프라켓 구동 방식, Center 정렬 방식

48, 70 mm 가변 가능

MAX 620mm

이오나이저 12개소 이상 설치

자석 봉 설치

제품 평탄도를 위하여 제품을 펴는 구조 설치

필름 패턴 검사 (이물, 스크래치 등) 칩 검사 (크랙, 미세 크랙 등)

PI 검사 (찍힘, 눌림 등)

2D Area Scan Camera, 계측기

패턴, Dent, Burr 검사 : Vision

칩 검사 : Vision 및 칩 용량 검사 (계측기 사용)

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Video View
 
현대 구조
LCD & OLED Vision Inspection Module
WVS-AKKON

LCD & OLED Panel의 도전볼을 검사하는 장치입니다.

A device that inspects the conductive particles of the LCD & OLED Panel.

제품사진6.jpg

 Insp. Model 

COG & COF & TAB Bonding Panel : 3.5 inch – 42 inch

Panel Sized

3.5 inch – 42 inch

Defects

The number, the strength, the length and the distribution of conductive particles

Insp.

Camera / Res.

4K TDI Mono Line Scan camera / 1.0 ㎛/pixel

Align.

Camera / Res

5M Mono Area Camera/3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec

Using x10 DIC(Differential Interference Contrast) Microscope

Video View
WVS-BONDER

A device that inspects the bonding status of the LCD & OLED Panel and Driver IC.

LCD & OLED Panel과 Driver IC의 Bonding 상태를 검사하는 장치입니다. 

제품사진7.jpg

Insp. Model

LCD & OLED Panel and Driver IC

Panel Sized

3.5 inch – 42 inch

Defects 

Driver IC recognition, Alignment

Insp.

Camera / Res. 

5M Mono Area Camera / 1.0 ㎛/pixel

Camera / Res. 

5M Mono Area Camera / 3.5 ㎛/pixel

Insp. Speed

Max 55 mm/sec

Video View
 
현대 구조
LCD & OLED Vision Inspection Module